For more advanced hardware with multiple sensor types per device
(e.g., SFP modules with temperature, voltage, current, and power
sensors), use the YANG parent/child relationship to group related
sensors together for better presentation.
Changes:
- Remove parent/parent-rel-pos deviations from infix-hardware.yang
- Create parent components (class: module) for multi-sensor devices
- Add parent references to child sensor components
- Add human-readable descriptions from hwmon labels
- Extend hwmon discovery to support voltage, current, and power
- Normalize sensor names: strip vendor prefixes (mt7915_phy0 -> phy0)
- Remove redundant TYPE column, clarify units (V -> VDC, add spaces)
- Simplify child sensor display by stripping parent prefix
- Fix "show system" to only show CPU temperature and fan speed
Example output from "show hardware":
NAME VALUE STATUS
===================================================
sfp1:
Rx Power 0.000 W ok
Tx Power 0.001 W ok
Vcc 3.35 VDC ok
Bias 0.006 A ok
Temperature 30.3 °C ok
sfp2:
Rx Power 0.000 W ok
Tx Power 0.001 W ok
Vcc 3.34 VDC ok
Bias 0.006 A ok
Temperature 32.0 °C ok
cpu 42.8 °C ok
phy0 47.0 °C ok
phy1 53.0 °C ok
Signed-off-by: Joachim Wiberg <troglobit@gmail.com>
- Remove class deviation to allow iana-hardware:sensor
- Populate sensor operational data from /sys/class/thermal
- Extend 'show hardware'
Signed-off-by: Joachim Wiberg <troglobit@gmail.com>
Prior to this commit yanger looked at the running system using
os.path..., this meant that the static reply / capture data wasn't
used properly. This resulted in strange behavior during unit testing
on GitHub runners where USB ports are missing.
Signed-off-by: Richard Alpe <richard@bit42.se>
Joachim Wiberg